TechConnect Seeks Technology and Early Stage Ventures for Summit Consideration.
SANTA CLARA, Calif.--(BUSINESS WIRE)--TechConnect (www.techconnect.org) announced today that it is accepting technology intellectual property (IP) and venture submissions for its upcoming TechConnect Summit 2007, to be held May 23-24 at the Santa Clara Convention Center. The TechConnect Summit is one of the largest and broadest showcases of the world’s most promising technology IP and early stage ventures. The TechConnect Summit is an ideal forum for both technology presenters and “pre-seed” to “early-stage” companies, giving each group the opportunity to demonstrate their technologies and market advantages before the financial and technology business community.
“The annual TechConnect Summit is unique in that it is the only venue that brings together the technical, business, and academic communities to share their ideas and explore potential investment and partnering opportunities, across multiple disciplines and industry sectors,” said Matthew Laudon, PhD, executive director and co-founder of TechConnect. “Accepted submissions will have the opportunity to network with leaders from the technology and business development communities, including TechConnect Board members, venture and corporate investors, and other potential business partners."
All submissions will be pre-screened by the TechConnect Board, which includes more than 40 members representing leading universities, companies, and investment groups from around the world. TechConnect Advisory Board Members include:
Analog Devices, Inc.|
Ford Motor Company
Imperial College London
Massachusetts Technology Transfer Center
The 2007 TechConnect Summit will also feature exclusive Corporate Partnering Presentations from top companies representing diverse industry sectors, including:
BASF Hewlett-Packard Genzyme Goodrich Honda Medtronic Merck Sanyo
To join the TechConnect 2007 (http://www.techconnect.org/Summit2007) community as a presenter, submit your IP or venture for review by the TechConnect Board. Accepted submissions will have the opportunity to present at the Summit, be featured prominently on the Summit web pages and program, and receive access to exclusive networking and matchmaking events.
To submit an IP, please visit http://www.techconnect.org/Summit2007/participate/IP/index.html
To submit an Early Stage Venture, please visit http://www.techconnect.org/Summit2007/participate/users/index.html
The submission deadline is February 2, 2007.
The TechConnect Summit will be co-located and run in conjunction with NSTI Nanotech 2007, the world’s largest nanotechnology conference and trade show. Celebrating its 10 year anniversary, Nanotech 2007 is expected to attract more than 4,000 scientists, engineers, business development professionals, funding companies and government attendees from around the word.
TechConnect (www.techconnect.org) is a global technology outreach organization, dedicated to locating the world’s most promising IP and start-up companies across all industries and technology focus areas. TechConnect is founded upon the application of the academic Peer-Review process towards the evaluation of emerging technologies and early stage venture companies. The annual TechConnect Summit provides the largest global snapshot of peer reviewed emerging technologies, IP and early stage companies based on their market impact and positioning.
The Nano Science and Technology Institute (NSTI; www.nsti.org) is chartered with the advancement and integration of nano and other advanced technologies through education, collaboration and research services. NSTI accomplishes this mission through its offerings of continuing education programs, conventions, scientific and business publishing and custom research services. NSTI produces the annual Nanotech conference and trade show.