TechConnect Innovation
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February 2017 Issue
Produced by TechConnect
 TechConnect News - Innovation Prospecting Upcoming Deadlines

TechConnect World Innovation Conference & Expo • May 14-17, 2017, Washington D.C.

» Submit Abstract
(Due Feb. 28)

   

» Submit Student Leader
(Due Feb. 28)

Smart Cities Connect Conference & Expo • June 26-28, 2017, Austin TX

» Submit Abstract
(Due Feb. 28)

   

» Submit Panel Proposal
(Due Feb. 28)

   

» Submit Innovation
(
Due March 17th)

 
 
 Next Events

TechConnect World
Innovation Conference

May 14-17, 2017• Washington DC
» Register Today!


National SBIR/STTR Conference

May 14-17, 2017 • Washington DC
» Register Today!

Smart Cities Connect
Conference & Expo

June 25-28, 2017 • Austin, TX
» Deadline: February 28th

Defense Innovation Summit

Oct. 3-5, 2017 • Tampa, FL
» Call for Innovations!
Federal Funding Opportunities:

National Science Foundation:

Ceramics
Deadline: Rolling

Condensed Matter and Materials Theory
Deadline: Rolling


Department of Transportation:

Under DoT Add: Hazardous Materials Transportation Safety Research and Development (2017)
Deadline: April 21, 2017



Department of Defense:

W81XWH-17-DMRDP-CRMRP-HBRA DoD Hearing and Balance Research Award
Deadline: March 29, 2017

DoD Precision Trauma Care Research Award
Deadline: June 15, 2017


SBIR/STTR:

BAA-12-02-PKS Sensor Innovative Research - Department of Defense
Deadline: April 5, 2017

 TechConnect Corporate Spotlights:
 

Corporate Spotlight Interview: Ingersoll Rand - TechConnect speaks with Leandre Adifon, Vice President Systems Engineering & Advanced Technology, at Ingersoll Rand about the importance of innovation and their participation at this year's TechConnect-National Innovation Summit in DC.

Leandre Adifon

Corporate Spotlight Interview: Eastman Chemical Company - TechConnect Innovation News speaks with Brendan Boyd, Director of Coatings, Specialty Fluids & External Innovation at Eastman Chemical Company.

Brendan Boyd

Corporate Spotlight Interview: Owens Corning - TechConnect Innovation News speaks with Dr. Chris Skinner, Director Front End Innovation, at Owens Corning.

Chris Skinner

Corporate Spotlight Interview: Evonik - TechConnect speaks with Dr. Sanjay Gupta, VP and Regional Head, Corporate Innovation at Evonik Corporation, about the company's technology/solution primary areas of interest.

Sanjay Gupta
 
 TechConnect Innovator Spotlights:
 

Active technologies seeking collaboration and funding opportunities. Featured innovators participated at the 2016 TechConnect World conference, Washington, DC.


Anti-Corrosion Paint/Primer Additive Based on Conjugated Polymer Nano-Dispersions - PolyDrop has developed an additive to paints and primers that provides anti-corrosion properties without the use of dangerous heavy metals or hexavalent chromium.


Disruptive, New Odor Removal Technology -This is a new technology that uses nano/micro sized particles to eliminate malodors in an effective and safe manner. It removes odors such as smoke, rotting food, body/foot odors, per odors, urine, bathroom odors and more. It scientifically removes the odors, not just relying on flowery scents.


 
  Increase Your Innovation Pipeline!

TechConnect delivers the world’s top vetted innovations to leading corporate, government, and investment executives. Become a 2017 TechConnect Corporate Acceleration Partner and increase your innovation pipeline with the largest pool of pre-vetted, early-stage technology opportunities. To learn more, click here.

2017 Corporate Partners Included:

2016 Corporate Partners

 
 TechConnect Innovation Updates
 
TCW 2017   SBIR/STTR 2017
NISS 2017 Smart Cities 2017
 

Share your technology, licensing, and investment stories with us!

Please contact Jen Rocha with your news item, and we may feature it in an upcoming edition.
Published by: Regina Ramazzini, Publishing Director

TechConnect is a global technology prospecting and accelerator organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world's top corporate, investment, and government partners. TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California.

Publishing Office: 955 Massachusetts Ave. #313 • Cambridge MA 02139, U.S.A.

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